Application 

• Panel 
• Substrate
• Wafer (4.6.8)
• IC carrier 
• Reticle
• FOWLP/FOPLP

Functions

• ESD protection
• Substrate broken detection
• Stage with dynamic balance for pick-place if large size panel
• Vacuum re-sticking proof
• Recipe editor/ CIM supported

Features

• Excellent removal of particles down to 0.3um.
• Non-contact cleaner with ultrasonic pressured air.
• Stand-along/In-line module.
• Non-destructive, chemical free.
• Applications for FPD/Wafer/IC Carrier Substrate/Reticle.
• Pre-clean process for backside. grinding/taping/plating/RIE...
• AP(atmospheric plasma)+Ozone optional enhanced. module for organic removal.